advanced power n-channel enhancement mode electronics corp. power mosfet simple drive requirement bv dss 30v small size & lower profile r ds(on) 4.5m rohs compliant & halogen-free i d 20.7a description absolute maximum ratings@ t j =25 o c(unless otherwise specified) symbol units v ds v v gs v i d @t a =25 a i d @t a =70 a i dm a p d @t a =25 w t stg t j symbol value unit rthj-c maximum thermal resistance, junction-case 5 /w rthj-a maximum thermal resistance, junction-ambient 3 40 /w data and specifications subject to change without notice 201503171 1 AP4024EYT rating halogen-free product 30 + 20 20.7 parameter drain-source voltage gate-source voltage drain current, v gs @ 10v 3 -55 to 150 drain current, v gs @ 10v 3 16.5 pulsed drain current 1 80 storage temperature range 3.12 -55 to 150 thermal data parameter total power dissipation operating junction temperature range d d d d s s s g pmpak ? 3 x 3 a p4024 series are from advanced power innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switching performance. it provides the designer with an extreme efficient device for use in a wide range of power applications. the pmpak ? 3x3 package is special for voltage conversion application using standard infrared reflow technique with the backside heat sink to achieve the good thermal performance. g d s .
electrical characteristics@t j =25 o c(unless otherwise specified) symbol parameter test conditions min. typ. max. units bv dss drain-source breakdown voltage v gs =0v, i d =250ua 30 - - v r ds(on) static drain-source on-resistance 2 v gs =10v, i d =20a - 3.6 4.5 m v gs =4.5v, i d =12a - 5.2 8.5 m v gs(th) gate threshold voltage v ds =v gs , i d =250ua 1.2 1.6 2.5 v g fs forward transconductance v ds =10v, i d =20a - 70 - s i dss drain-source leakage current v ds =24v, v gs =0v - - 10 ua i gss gate-source leakage v gs =+ 20v, v ds =0v - - + 30 ua q g total gate charge i d =12a - 15 24 nc q gs gate-source charge v ds =15v - 4 - nc q gd gate-drain ("miller") charge v gs =4.5v - 7 - nc t d(on) turn-on delay time v ds =15v - 14 - ns t r rise time i d =1a - 10 - ns t d(off) turn-off delay time r g =6 -33- ns t f fall time v gs =10v - 18 - ns c iss input capacitance v gs =0v - 1500 2400 pf c oss output capacitance v ds =15v - 320 - pf c rss reverse transfer capacitance f=1.0mhz - 210 - pf r g gate resistance f=1.0mhz - 1.2 2.4 source-drain diode symbol parameter test conditions min. typ. max. units v sd forward on voltage 2 i s =2.9a, v gs =0v - - 1.2 v t rr reverse recovery time i s =20a, v gs =0 v , - 20 - ns q rr reverse recovery charge di/dt=100a/s - 5 - nc notes: 1.pulse width limited by max. junction temperature. 2.pulse test this product is sensitive to electrostatic discharge, please handle with caution. use of this product as a critical component in life support or other similar systems is not authorized. apec does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. apec reserves the right to make changes without further notice to any products herein to improve reliability, function or design. 3.surface mounted on 1 in 2 2oz copper pad of fr4 board, t < 10sec; 210 o c/w when mounted on min. copper pad. 2 AP4024EYT .
ap4024ey t fig 1. typical output characteristics fig 2. typical output characteristics fig 3. on-resistance v.s. gate voltage fig 4. normalized on-resistance v.s. junction temperature fi g 5. forward characteristic o f fig 6. gate threshold voltage v.s. reverse diode junction temperature 3 0 40 80 120 160 0246810 v ds , drain-to-source voltage (v) i d , drain current (a) 10v 9.0v 8.0v 7.0v 6.0v 5.0v v g = 4.0v t a =25 o c 0 20 40 60 80 100 01234 v ds , drain-to-source voltage (v) i d , drain current (a) t a = 150 o c 10v 9.0v 8.0v 7.0v 6.0v 5.0v v g = 4.0v 3.2 3.6 4 4.4 4.8 5.2 5.6 6 246810 v gs , gate-to-source voltage (v) r ds(on) (m ) i d =12a t a =25 0.4 0.8 1.2 1.6 2.0 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized r ds(on) i d =20a v g =10v 0.0 0.4 0.8 1.2 1.6 2.0 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized v gs(th) 0 4 8 12 16 20 0 0.2 0.4 0.6 0.8 1 1.2 v sd , source-to-drain voltage (v) i s (a) t j =25 o c t j =150 o c i d =250ua .
ap4024ey t fig 7. gate charge characteristics fig 8. typical capacitance characteristics fig 9. maximum safe operating area fig 10. effective transient thermal impedance fig 11. transfer characteristics fig 12. drain current v.s. ambient temperature 4 0 2 4 6 8 0 8 16 24 32 q g , total gate charge (nc) v gs , gate to source voltage (v) i d =12a v ds =15v 0 400 800 1200 1600 2000 1 5 9 13172125293337 v ds , drain-to-source voltage (v) c (pf) f =1.0mh z c iss c oss c rss 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 10 100 1000 t , pulse width (s) normalized thermal response (r thja ) p dm duty factor = t/t peak t j = p dm x r thja + t a r thia =210 /w t t 0.02 0.01 0.05 0.1 0.2 duty factor=0.5 single pulse 0.01 0.1 1 10 100 0.01 0.1 1 10 100 v ds , drain-to-source voltage (v) i d (a) t a =25 o c single pulse 100us 1ms 10ms 100ms 1s dc operation in this area limited by r ds(on) 0 20 40 60 80 100 0123456 v gs , gate-to-source voltage (v) i d , drain current (a) t j =150 o c t j =25 o c v ds =5v 0 4 8 12 16 20 24 25 50 75 100 125 150 t a , ambient temperature ( o c ) i d , drain current (a) t j = -40 o c .
ap4024ey t fig 13. normalized bv dss v.s. junction fig 14. total power dissipation fig 15. typ. drain-source on state resistance 5 0 4 8 12 16 20 0 20406080 i d , drain current (a) r ds(on) (m ) t j =25 o c 4.5v 5.0v v gs =10v 0 1 2 3 4 5 0 50 100 150 t a , ambient temperature( o c) p d , power dissipation(w) 0 0.4 0.8 1.2 1.6 2 -100 -50 0 50 100 150 t j , junction temperature ( o c) normalized bv dss i d =1ma .
AP4024EYT marking information 6 part numbe r date code (ywwsss) y last digit of the year ww week sss sequence 4024e ywwsss .
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